Title :
Multichip module technologies, a win-win strategy based on technology leverage and convergence for IC supplies and workstation customers
Author :
Nagesh, V.K. ; Miller, Dan
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
Abstract :
Trends in packaging technologies are reviewed. It is suggested that advanced packaging solutions such as multichip modules (MCMs) will make possible future high-performance workstations. High I/O count, signal frequency, integrity, and power and low cost will drive the packaging solutions for WS. Single-chip packages will become better and may postpone use of bare chip MCMs: bare chip MCMs will be essential for top performance. Cu/PI-type substrates are still too expensive; AlN, glass ceramic, and advanced printed circuit boards will be attractive options; multilevel thick-film finelines can bridge the substrate interconnect cost/performance gap
Keywords :
multichip modules; packaging; workstations; AlN; I/O count; IC supplies; advanced printed circuit boards; bare chip MCMs; convergence; copper-polyimide-type substrates; glass ceramic; multilevel thick-film finelines; packaging technologies; signal frequency; single-chip packages; technology leverage; win-win strategy; workstation customers; Bridge circuits; Ceramics; Costs; Frequency; Glass; Integrated circuit interconnections; Multichip modules; Packaging; Printed circuits; Workstations;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204196
