Multichip module technologies, a win-win strategy based on technology leverage and convergence for IC supplies and workstation customers

Author

Nagesh, V.K. ; Miller, Dan

Author_Institution

Hewlett-Packard Co., Palo Alto, CA, USA

fYear

1992

fDate

18-20 May 1992

Firstpage

134

Lastpage

135

Abstract

Trends in packaging technologies are reviewed. It is suggested that advanced packaging solutions such as multichip modules (MCMs) will make possible future high-performance workstations. High I/O count, signal frequency, integrity, and power and low cost will drive the packaging solutions for WS. Single-chip packages will become better and may postpone use of bare chip MCMs: bare chip MCMs will be essential for top performance. Cu/PI-type substrates are still too expensive; AlN, glass ceramic, and advanced printed circuit boards will be attractive options; multilevel thick-film finelines can bridge the substrate interconnect cost/performance gap

Keywords

multichip modules; packaging; workstations; AlN; I/O count; IC supplies; advanced printed circuit boards; bare chip MCMs; convergence; copper-polyimide-type substrates; glass ceramic; multilevel thick-film finelines; packaging technologies; signal frequency; single-chip packages; technology leverage; win-win strategy; workstation customers; Bridge circuits; Ceramics; Costs; Frequency; Glass; Integrated circuit interconnections; Multichip modules; Packaging; Printed circuits; Workstations;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1992. Proceedings., 42nd

Conference_Location

San Diego, CA

Print_ISBN

0-7803-0167-6

Type

conf

DOI

10.1109/ECTC.1992.204196

Filename

204196