DocumentCode
3087389
Title
A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications
Author
Boeuf, F. ; Cremer, Sebastien ; Vulliet, Nathalie ; Pinguet, T. ; Mekis, A. ; Masini, G. ; Verslegers, L. ; Sun, P. ; Ayazi, A. ; Hon, N.-K. ; Sahni, Shashank ; Chi, Y. ; Orlando, B. ; Ristoiu, D. ; Farcy, A. ; Leverd, F. ; Broussous, L. ; Pelissier-Tanon
Author_Institution
STMicroelectron., Crolles, France
fYear
2013
fDate
9-11 Dec. 2013
Abstract
Recently Silicon Photonics has generated an outstanding interest for integrated optical communications. In this paper we describe a 300mm Silicon Photonics platform designed for 25Gb/s and above applications at the three typical communication wavelengths and compatible with 3D integration. Main process features and device results are described.
Keywords
integrated optoelectronics; optical communication equipment; silicon-on-insulator; 3D integration; SOI wafers; Si; bit rate 25 Gbit/s; communication wavelengths; integrated optical communications; multiwavelength 3D-compatible silicon photonics; size 300 mm; High-speed optical techniques; Integrated optics; Optical waveguides; Phase modulation; Photonics; Propagation losses; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location
Washington, DC
Type
conf
DOI
10.1109/IEDM.2013.6724623
Filename
6724623
Link To Document