Title :
300mm size ultra-thin glass interposer technology and high-Q embedded helical inductor (EHI) for mobile application
Author :
Lai, W.C. ; Chuang, H.H. ; Tsai, C.H. ; Yeh, E.H. ; Lin, C.H. ; Peng, T.H. ; Yen, L.J. ; Liao, W.S. ; Hung, J.N. ; Sheu, C.C. ; Yu, Cody Hao ; Wang, C.T. ; Yee, K.C. ; Yu, Daren
Author_Institution :
R&D, Taiwan Semicond. Manuf. Co., Ltd., Hsinchu, Taiwan
Abstract :
The first publication on fabrication of a 300 mm size, 50 μm ultra-thin glass interposer is presented. According to measured data and modeling analysis, merits of on-glass inductors and transmission lines outperform those of on-silicon in Q-factor, power dissipation, and power/signal integrity. Glass interposer is a promising building block technology for future hybrid mixed signal heterogeneous chip integration solution.
Keywords :
elemental semiconductors; glass; inductors; integrated circuit packaging; mixed analogue-digital integrated circuits; silicon; EHI; Q-factor; Si; high-Q embedded helical inductor; hybrid mixed signal heterogeneous chip integration; mobile application; on-glass inductors; power dissipation; power/signal integrity; size 300 mm; size 50 mum; transmission lines; ultra-thin glass interposer technology; Fabrication; Glass; Inductors; Power transmission lines; Radio frequency; Silicon; Spirals;
Conference_Titel :
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location :
Washington, DC
DOI :
10.1109/IEDM.2013.6724624
