Title :
Opportunities and challenges of the 450mm transition
Author :
Lin, James ; Pinyen Lin ; Wen-Yu Ku ; Kelling, Mark C. ; Akiki, Greg ; Sangdong Kwon ; Kwangwook Lee ; Collison, Wenli ; Chang, Silvia ; Cottle, Rand ; Yu-Chih Wang ; Borst, Christopher ; Skilbred, David ; Robertson, Frank ; Farrar, Paul
Author_Institution :
Global 450mm Consortium, Albany, NY, USA
Abstract :
A close collaboration among IC makers, equipment and material suppliers, facility, and automation providers resulted in better alignment in the technology roadmap and lower development costs for tools and wafers. This would enable the cost-effective operation of future 450mm HVM fabs. The 450mm transition will certainly create another prosperous opportunity for the semiconductor industry.
Keywords :
integrated circuit manufacture; semiconductor industry; HVM fabs; IC makers; automation providers; cost-effective operation; equipment suppliers; facility; material suppliers; semiconductor industry; size 450 nm; technology roadmap; Companies; Films; Green products; Lithography; Plasmas; Throughput;
Conference_Titel :
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location :
Washington, DC
DOI :
10.1109/IEDM.2013.6724626
