New type film-adhesives for microelectronics application

Author

Sakamoto, Y. ; Takeda, N. ; Takeda, T. ; Tokoh, A. ; Tang, D.Y.

Author_Institution

Sumitomo Bakelite Co. Ltd., Yokohama, Japan

fYear

1992

fDate

18-20 May 1992

Firstpage

215

Lastpage

218

Abstract

Polyimidesiloxanes (SIM-X) were prepared and investigated in applications as film adhesive for microelectronics. SIM-X have low T _g, low modulus, and low moisture absorption. A film composed of SIM-X and conductive filler (silver) shows good adhesion. It was found that the evaluated SIM was able to adhere to several adherends at lower temperature and under lower load than the usual condition. Applications to silver-filled film-adhesive for heatsink and die attachment were investigated. In the case of the heatsink, improvements of adhesive strength at high temperature and with PCT treatment were studied. The problems were solved in the following manner: (1) adhesion at higher temperature and (2) modification of the polymer. In the case of die attachment, the die rapidly adhered to leadframe at low temperature. This result indicates that inline attachment will be possible

Keywords

adhesion; filled polymers; heat sinks; packaging; SIM-X; adhesive strength; conductive filler; die attachment; heatsink; inline attachment; leadframe; microelectronics application; moisture absorption; polyimidesiloxanes; Absorption; Adhesive strength; Conductive films; Impurities; Microelectronics; Moisture; Polyimides; Polymer films; Semiconductor films; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1992. Proceedings., 42nd

Conference_Location

San Diego, CA

Print_ISBN

0-7803-0167-6

Type

conf

DOI

10.1109/ECTC.1992.204209

Filename

204209