• DocumentCode
    3087540
  • Title

    Optimal single probe traversal algorithm for testing of MCM substrate

  • Author

    Pendurkar, Rajesh ; Chatterjee, Avhishek ; Tovey, Craig

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    1996
  • fDate
    7-9 Oct 1996
  • Firstpage
    396
  • Lastpage
    401
  • Abstract
    An algorithm for finding the optimal traversal route of a single probe to test MCM interconnects is presented. The goal of this work is to optimize the total distance traveled by a single test probe on an MCM substrate and thereby reduce the substrate testing time. It is assumed that only one terminal pad of each interconnection net is to be probed. Our algorithm is based on tour construction and improvement with arbitrary insertion for solving a complex variation of the traveling salesman problem. Improved insertion and shuffling techniques guarantee the step by step optimization of the total traversal cost. The validity of the algorithm has been confirmed with experiments and shows that up to 50% reduction in probe traversal time can be obtained with our technique
  • Keywords
    circuit CAD; integrated circuit design; integrated circuit testing; multichip modules; optimisation; substrates; travelling salesman problems; MCM interconnects; MCM substrate testing; arbitrary insertion; electronics industry; interconnection net; multichip modules; optimal single probe traversal algorithm; probe traversal time; semiconductor chips; shuffling techniques; single probe; terminal pad; total distance; total traversal cost; tour construction; traveling salesman problem; Assembly; Computer industry; Costs; Electronics industry; Electronics packaging; Probes; Semiconductor device packaging; Substrates; System testing; Systems engineering and theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design: VLSI in Computers and Processors, 1996. ICCD '96. Proceedings., 1996 IEEE International Conference on
  • Conference_Location
    Austin, TX
  • ISSN
    1063-6404
  • Print_ISBN
    0-8186-7554-3
  • Type

    conf

  • DOI
    10.1109/ICCD.1996.563585
  • Filename
    563585