Title :
Solderless high-density interconnects for burn-in applications
Author :
Guarin, Femando J. ; Katsetos, Anastasios A.
Author_Institution :
IBM, East Fishkill, NY, USA
Abstract :
The development and evaluation of a high-contact-density burn-in socket for a pinless module with 1156 terminals and an intended useful life of at least 1000 h at 200°C are described. Characterization and stress data for wire button contacts realized in various metallurgies along with results for elastomer contacts are presented. Contact integrity and resistance were monitored while under temperature and current accelerated stress. A molybdenum wire button prototype socket was successfully constructed and stress tested
Keywords :
elastomers; electric connectors; electrical contacts; life testing; modules; 1000 h; 200 degC; burn-in applications; burn-in socket; contact integrity; contact resistance; current accelerated stress; elastomer contacts; pinless module; stress data; temperature accelerated stress; wire button contacts; Contact resistance; Copper; Gold; Immune system; Insulation; Semiconductor devices; Sockets; Stress; Temperature distribution; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204217
