DocumentCode
3087758
Title
Full chip ESD design rule checking
Author
Li, Q. ; Huh, Y.J. ; Chen, J.W. ; Bendix, P. ; Kang, S.M.
Author_Institution
IBM Microelectron., Fishkill, NY, USA
Volume
5
fYear
2001
fDate
2001
Firstpage
503
Abstract
Electrostatic discharge (ESD) protection is essential for reliability and high yield. ESD design rule checking, however, is beyond the scope of commercial DRC tools. We have presented previously an ESD design rule checker for individual I/O cells. Full chip ESD design rules come in a myriad number of ways and are heavily process dependent. To check them one by one requires rewriting the design rule checker program for each process generation. This paper presents a framework for full chip ESD design rule checking adaptive to how full chip ESD design rules are derived
Keywords
circuit CAD; electrostatic discharge; integrated circuit design; protection; ESD protection; electrostatic discharge protection; full chip ESD design rule checking; high yield; reliability; Clamps; Electrostatic discharge; Integrated circuit interconnections; Logic circuits; Microelectronics; Power engineering and energy; Protection; Stress; Variable structure systems; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2001. ISCAS 2001. The 2001 IEEE International Symposium on
Conference_Location
Sydney, NSW
Print_ISBN
0-7803-6685-9
Type
conf
DOI
10.1109/ISCAS.2001.922095
Filename
922095
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