• DocumentCode
    3087758
  • Title

    Full chip ESD design rule checking

  • Author

    Li, Q. ; Huh, Y.J. ; Chen, J.W. ; Bendix, P. ; Kang, S.M.

  • Author_Institution
    IBM Microelectron., Fishkill, NY, USA
  • Volume
    5
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    503
  • Abstract
    Electrostatic discharge (ESD) protection is essential for reliability and high yield. ESD design rule checking, however, is beyond the scope of commercial DRC tools. We have presented previously an ESD design rule checker for individual I/O cells. Full chip ESD design rules come in a myriad number of ways and are heavily process dependent. To check them one by one requires rewriting the design rule checker program for each process generation. This paper presents a framework for full chip ESD design rule checking adaptive to how full chip ESD design rules are derived
  • Keywords
    circuit CAD; electrostatic discharge; integrated circuit design; protection; ESD protection; electrostatic discharge protection; full chip ESD design rule checking; high yield; reliability; Clamps; Electrostatic discharge; Integrated circuit interconnections; Logic circuits; Microelectronics; Power engineering and energy; Protection; Stress; Variable structure systems; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2001. ISCAS 2001. The 2001 IEEE International Symposium on
  • Conference_Location
    Sydney, NSW
  • Print_ISBN
    0-7803-6685-9
  • Type

    conf

  • DOI
    10.1109/ISCAS.2001.922095
  • Filename
    922095