Title :
Full chip ESD design rule checking
Author :
Li, Q. ; Huh, Y.J. ; Chen, J.W. ; Bendix, P. ; Kang, S.M.
Author_Institution :
IBM Microelectron., Fishkill, NY, USA
Abstract :
Electrostatic discharge (ESD) protection is essential for reliability and high yield. ESD design rule checking, however, is beyond the scope of commercial DRC tools. We have presented previously an ESD design rule checker for individual I/O cells. Full chip ESD design rules come in a myriad number of ways and are heavily process dependent. To check them one by one requires rewriting the design rule checker program for each process generation. This paper presents a framework for full chip ESD design rule checking adaptive to how full chip ESD design rules are derived
Keywords :
circuit CAD; electrostatic discharge; integrated circuit design; protection; ESD protection; electrostatic discharge protection; full chip ESD design rule checking; high yield; reliability; Clamps; Electrostatic discharge; Integrated circuit interconnections; Logic circuits; Microelectronics; Power engineering and energy; Protection; Stress; Variable structure systems; Voltage;
Conference_Titel :
Circuits and Systems, 2001. ISCAS 2001. The 2001 IEEE International Symposium on
Conference_Location :
Sydney, NSW
Print_ISBN :
0-7803-6685-9
DOI :
10.1109/ISCAS.2001.922095