• DocumentCode
    3087806
  • Title

    Ceramic varistor fabricated by surface diffusion

  • Author

    Fu, Shen-Li ; Chao, Kao-You

  • Author_Institution
    Kaohsiung Polytech. Inst., Taiwan
  • fYear
    1992
  • fDate
    18-20 May 1992
  • Firstpage
    306
  • Lastpage
    310
  • Abstract
    A novel ceramic varistor was fabricated by the surface diffusion of grain boundary materials into the semiconductive ceramic substrate. (Ba0.8Sr0.2)(Ti0.9Zr0.1)O 3 (BSTZ) doped with 0.2 mol.% Nb2O5 was adopted as the ceramic substrate. The powder blends of LiCO2 and Bi2O3, with molar ratios of Li2CO 3/Bi2O3 (Li/Bi)=1/1 and 11/89 were adopted as the grain boundary material for surface diffusion. Better varistor characteristics were obtained by diffusing Li/Bi=11/89 into the BSTZ substrate. By surface diffusing Li/Bi=1/1 into 0.2 mol.% Nb2 O5-doped BSTZ substrate at 1080°C for 2 h, a varistor with a varistor constant of 6 and VB=28 V was fabricated. While diffusing Li/Bi=11/89 at 1100°C into the same substrate, the varistor voltage was also 28 V with a higher varistor constant of 14. The average breakdown voltage per grain boundary of Li/Bi=11/89 diffused BSTZ was about 0.4 V/grain boundary, which is much smaller than that of ZnO ceramic varistor. A model similar to the n-C-i-C-n model is adopted to explain the results obtained
  • Keywords
    ceramics; grain boundaries; surface diffusion; varistors; (Ba0.8Sr0.2)(Ti0.9Zr0.1 )O3: Nb2O5, Li, Bi; 1080 degC; 1100 degC; 28 V; Bi2O3; LiCO2; Nb2O5-doped BSTZ substrate; ceramic varistor; grain boundary materials; n-C-i-C-n model; powder blends; semiconductive ceramic substrate; surface diffusion; Bismuth; Ceramics; Grain boundaries; Niobium; Powders; Semiconductor materials; Strontium; Substrates; Varistors; Zirconium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1992. Proceedings., 42nd
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-0167-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1992.204224
  • Filename
    204224