Title :
Numerical analysis for thermal field of susceptor in MOCVD reactor
Author :
Kuo-Hung Ho ; Chih-Kai Hu ; Li, Tomi T.
Author_Institution :
Dept. of Mech. Eng., Nat. Central Univ., Taoyuan, Taiwan
Abstract :
A MOCVD process requires not only high heating efficiency, but also good temperature uniformity on susceptor surface. The most common material of susceptor is graphite, but the heating lifetime is very short. Instead, this work uses the SiC as susceptor material. It enhances both the lifetime and thermal conductivity. In the meantime, we also change the shape and structure of susceptor to improve the temperature uniformity on the surface. In addition, the gas flow rate and wall temperature will affect the temperature uniformity thus the analysis of thermal flow field is also included. By using above methods, the temperature uniformity of susceptor can improve about 45%.
Keywords :
MOCVD; graphite; heating; numerical analysis; thermal conductivity; wide band gap semiconductors; MOCVD reactor; SiC; gas flow rate; graphite; heating efficiency; metal organic chemical vapor deposition; numerical analysis; susceptor thermal field; temperature uniformity; thermal conductivity; thermal flow field; Coatings; Heating; Inductors; MOCVD; Standards; MOCVD; SiC susceptor; temperature uniformity;
Conference_Titel :
Semiconductor Technology International Conference (CSTIC), 2015 China
Conference_Location :
Shanghai
DOI :
10.1109/CSTIC.2015.7153470