• DocumentCode
    3087862
  • Title

    Elastomeric sockets for chip carriers and MCMs

  • Author

    Buchoff, Leonard S.

  • Author_Institution
    Elastomeric Technol. Inc., Hatboro, PA, USA
  • fYear
    1992
  • fDate
    18-20 May 1992
  • Firstpage
    316
  • Lastpage
    320
  • Abstract
    Sockets containing elastomeric elements have been successful in connecting very high density leadless chip packages and LGAs to PWBs (printed wiring boards). Connections are made by sandwiching the elements between the two mated substrates, producing a zero insertion force contact. The elastomer effectively seals out moisture and other degrading environments, ensuring long, reliable operation. The two elastomeric elements that are the most effective are the layered connectors and the metal-in-elastomer elements. These elements are described, and the development of sockets for MCMs (multichip modules) and chip carriers is described. Attention is given to test and burn-in sockets, permanent connections, and electronic package design
  • Keywords
    elastomers; electric connectors; multichip modules; packaging; printed circuit accessories; LGAs; MCMs; PCB; PWBs; ZIF contact; burn-in sockets; chip carriers; elastomeric sockets; electronic package design; land grid array; layered connectors; leadless chip packages; metal-in-elastomer elements; multichip modules; permanent connections; printed wiring boards; zero insertion force contact; Connectors; Contacts; Degradation; Joining processes; Moisture; Multichip modules; Packaging; Seals; Sockets; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1992. Proceedings., 42nd
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-0167-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1992.204226
  • Filename
    204226