DocumentCode
3087862
Title
Elastomeric sockets for chip carriers and MCMs
Author
Buchoff, Leonard S.
Author_Institution
Elastomeric Technol. Inc., Hatboro, PA, USA
fYear
1992
fDate
18-20 May 1992
Firstpage
316
Lastpage
320
Abstract
Sockets containing elastomeric elements have been successful in connecting very high density leadless chip packages and LGAs to PWBs (printed wiring boards). Connections are made by sandwiching the elements between the two mated substrates, producing a zero insertion force contact. The elastomer effectively seals out moisture and other degrading environments, ensuring long, reliable operation. The two elastomeric elements that are the most effective are the layered connectors and the metal-in-elastomer elements. These elements are described, and the development of sockets for MCMs (multichip modules) and chip carriers is described. Attention is given to test and burn-in sockets, permanent connections, and electronic package design
Keywords
elastomers; electric connectors; multichip modules; packaging; printed circuit accessories; LGAs; MCMs; PCB; PWBs; ZIF contact; burn-in sockets; chip carriers; elastomeric sockets; electronic package design; land grid array; layered connectors; leadless chip packages; metal-in-elastomer elements; multichip modules; permanent connections; printed wiring boards; zero insertion force contact; Connectors; Contacts; Degradation; Joining processes; Moisture; Multichip modules; Packaging; Seals; Sockets; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location
San Diego, CA
Print_ISBN
0-7803-0167-6
Type
conf
DOI
10.1109/ECTC.1992.204226
Filename
204226
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