DocumentCode
3088122
Title
Foundry-CMOS integrated oscillator circuits based on ultra-low power ovenized CMOS-MEMS resonators
Author
Ming-Huang Li ; Chao-Yu Chen ; Cheng-Syun Li ; Chi-Hang Chin ; Cheng-Chi Chen ; Sheng-Shian Li
Author_Institution
Inst. of NanoEngineering & Microsyst., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear
2013
fDate
9-11 Dec. 2013
Abstract
A cutting-edge ovenized micromechanical resonator circuit comprised of a double-ended tuning fork (DETF) resonator and serpentine-shaped heaters to enable ultra-low heater power of only 0.47 mW over the entire temperature range (-40°C to 85°C) has been reported for the first time in a low-cost, foundry CMOS-based fabrication platform. The combination of low thermal conductivity materials (i.e., SiO2 and poly-Si) and high thermal isolation designs is key to attaining low heater power consumption in a sub-mW level. An ovenized 1.2-MHz CMOS-MEMS oscillator with a phase noise lower than -103 dBc/Hz at 1-kHz offset and -110 dBc/Hz at 1-MHz offset was also demonstrated in this work, verifying the great potential of low power oven-controlled MEMS oscillators realized using the well-established CMOS-MEMS technology.
Keywords
CMOS analogue integrated circuits; low-power electronics; micromechanical resonators; oscillators; phase noise; thermal conductivity; DETF resonator; cutting-edge ovenized micromechanical resonator circuit; double-ended tuning fork resonator; foundry-CMOS integrated oscillator circuits; frequency 1.2 MHz; high thermal isolation designs; low heater power consumption; low power oven-controlled MEMS oscillators; low thermal conductivity materials; low-cost foundry CMOS-based fabrication platform; phase noise; power 0.47 mW; serpentine-shaped heaters; temperature -40 degC to 85 degC; ultra-low power ovenized CMOS-MEMS resonators; Frequency measurement; Heating; Micromechanical devices; Optical resonators; Oscillators; Resonant frequency; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location
Washington, DC
Type
conf
DOI
10.1109/IEDM.2013.6724654
Filename
6724654
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