Title :
The technology for over 300-pin QFPs
Author :
Shirai, Yuji ; Otsuka, Kanji ; Okinaga, Takayuki ; Suzuki, Hiromichi ; Murakami, Gen ; Arai, Kiyokazu ; Satuu, Yuichi ; Emata, Takashi ; Matsunaga, Toshihiro
Author_Institution :
Hitachi Ltd., Tokyo, Japan
Abstract :
By merely changing the lead frame structure, high-performance QFPs (quad flat packages) were developed without any new technology. This technology makes successfully up to 304-pin QFPs. The lead frame structure is two layers for a high-speed signal and even for thermal management. The outer lead pitch is 0.5 mm. The 28-mm and 40-mm square body sizes are achieved in such a high pin count. The approach leads to low cost and high productivity and reliability
Keywords :
integrated circuit technology; large scale integration; packaging; 0.5 mm; QFPs; high pin count; lead frame structure; outer lead pitch; quad flat packages; thermal management; Ambient intelligence; Bonding; Costs; Electronics packaging; Frequency; Inductance; Integrated circuit interconnections; Lead; Thermal management; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204242
