DocumentCode :
3088292
Title :
Investigation of thermo-mechanically induced stress in a PQFP 160 using finite element techniques
Author :
Kelly, G. ; Lyden, C. ; O´Mathuna, C. ; Campbell, J.S.
Author_Institution :
Nat. Microelectron. Res. Centre, Univ. Coll., Cork, Ireland
fYear :
1992
fDate :
18-20 May 1992
Firstpage :
467
Lastpage :
472
Abstract :
The authors use finite element (FE) techniques to illustrate how thermomechanical stresses are built up within a plastic IC package, due to encapsulation. Plane strain is chosen as the most suitable 2D FE model for the thermomechanical stress analysis of plastic packages. The compressive stress on the die is separated into direct and bending components of stress. This is used to show that the molding compound induces over half of the encapsulation stress into the die. An explanation of the compressive stress distribution throughout the die is presented. The encapsulation stress on the die can be eliminated by isolating the die from the package with a side buffer of soft material
Keywords :
encapsulation; finite element analysis; integrated circuit technology; packaging; stress analysis; 2D FEM model; PQFP 160; compressive stress distribution; encapsulation stress; finite element techniques; molding compound; plastic IC package; plastic quad flat pack; thermo-mechanically induced stress; thermomechanical stress analysis; thermomechanical stresses; Capacitive sensors; Compressive stress; Encapsulation; Finite element methods; Integrated circuit modeling; Microassembly; Plastic integrated circuit packaging; Tensile stress; Thermal stresses; Thermomechanical processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
Type :
conf
DOI :
10.1109/ECTC.1992.204247
Filename :
204247
Link To Document :
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