Title :
Palladium enhanced dry soldering process
Author :
Yeh, Helen L. ; Strickman, Steven
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
The authors report an enhancement technique for promoting a dry soldering process without the use of the wet chemical flux. A thin layer of Pd (about 1000 Å) on the surface of the areas to be soldered was found to be effective in promoting the solder wetting and joining. The effectiveness of the PD coating was studied at temperatures from 215 to 350°C in hydrogen and forming gas ambient. Both a low-temperature solder (eutectic PbSn) and a high-temperature solder (Pb5Sn) were tested. The structure and the effectiveness of palladium coatings prepared by the immersion plating and the evaporation were compared. Applications would be in the SMT (surface mounting technology), pin brazing, pin soldering, and other soldering/bonding operations
Keywords :
lead alloys; metallic thin films; microassembling; palladium; soldering; surface mount technology; tin alloys; 1000 A; 215 to 350 C; H2 ambient gas; PD coating; PbSn alloys; SMT; dry soldering process; enhancement technique; fluxless soldering; forming gas ambient; high-temperature solder; immersion plating; low-temperature solder; pin brazing; pin soldering; solder wetting; surface mounting technology; Atmosphere; Chemical processes; Cleaning; Coatings; Gases; Hydrogen; Palladium; Soldering; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204251
