DocumentCode :
3088427
Title :
Strained Germanium quantum well pMOS FinFETs fabricated on in situ phosphorus-doped SiGe strain relaxed buffer layers using a replacement Fin process
Author :
Witters, L. ; Mitard, J. ; Loo, Roger ; Eneman, Geert ; Mertens, Hans ; Brunco, D.P. ; Lee, S.H. ; Waldron, Niamh ; Hikavyy, Andriy ; Favia, Paola ; Milenin, A.P. ; Shimura, Y. ; Vrancken, C. ; Bender, Hugo ; Horiguchi, Naoto ; Barla, Kathy ; Thean, A. ;
Author_Institution :
IMEC, Leuven, Belgium
fYear :
2013
fDate :
9-11 Dec. 2013
Abstract :
Strained Ge p-channel FinFETs on Strain Relaxed SiGe are reported for the first time, demonstrating peak transconductance gmSAT of 1.3mS/μm at VDS=-0.5V and good short channel control down to 60nm gate length. Optimization of P-doping in the SiGe, optimized Si cap passivation thickness on the Ge, and improved gate wrap of the channel all improve device characteristics. The Ge FinFETs presented in this work outperform published relaxed Ge FinFET devices for the gmSAT/SSSAT benchmarking metric.
Keywords :
Ge-Si alloys; MOSFET; buffer layers; passivation; phosphorus; quantum well devices; semiconductor doping; P-doping; SiGe:P; cap passivation thickness; p-channel FinFET; quantum well pMOS FinFET; replacement fin process; short channel control; size 60 nm; strain relaxed buffer layers; voltage -0.5 V; FinFETs; Logic gates; Optimization; Silicon; Silicon germanium; Standards; Strain;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location :
Washington, DC
Type :
conf
DOI :
10.1109/IEDM.2013.6724669
Filename :
6724669
Link To Document :
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