Author :
Witters, L. ; Mitard, J. ; Loo, Roger ; Eneman, Geert ; Mertens, Hans ; Brunco, D.P. ; Lee, S.H. ; Waldron, Niamh ; Hikavyy, Andriy ; Favia, Paola ; Milenin, A.P. ; Shimura, Y. ; Vrancken, C. ; Bender, Hugo ; Horiguchi, Naoto ; Barla, Kathy ; Thean, A. ;
Abstract :
Strained Ge p-channel FinFETs on Strain Relaxed SiGe are reported for the first time, demonstrating peak transconductance gmSAT of 1.3mS/μm at VDS=-0.5V and good short channel control down to 60nm gate length. Optimization of P-doping in the SiGe, optimized Si cap passivation thickness on the Ge, and improved gate wrap of the channel all improve device characteristics. The Ge FinFETs presented in this work outperform published relaxed Ge FinFET devices for the gmSAT/SSSAT benchmarking metric.
Keywords :
Ge-Si alloys; MOSFET; buffer layers; passivation; phosphorus; quantum well devices; semiconductor doping; P-doping; SiGe:P; cap passivation thickness; p-channel FinFET; quantum well pMOS FinFET; replacement fin process; short channel control; size 60 nm; strain relaxed buffer layers; voltage -0.5 V; FinFETs; Logic gates; Optimization; Silicon; Silicon germanium; Standards; Strain;