Ceramic greensheet technology for glass-ceramic/copper multilevel substrates (ES9000 system)

Author

Nufer, R.W.

Author_Institution

IBM Technol. Products, Hopewell Junction, NY, USA

fYear

1992

fDate

18-20 May 1992

Firstpage

673

Lastpage

677

Abstract

IBM´s high end computers, models 820 and 900 of the ES9000 systems, use one of the most advanced substrates to achieve their high ultimate performance. These substrates are fabricated using a multilayer ceramic (MLC) process based on a specially developed ceramic green sheet. The author discusses the development of the green sheet, emphasizing the importance of the polymeric binder system that provides a very stable sheet insuring the alignment of millions of vias and internal interconnections. Green sheet binder formulations are reviewed, illustrating the contribution of the solvents in controlling sheet microporosity. The continuous casting process used in sheet preparation, slurry rheology, and green sheet properties is described

Keywords

IBM computers; casting; ceramics; hybrid integrated circuits; mainframes; multichip modules; porosity; substrates; thick film circuits; Cu; ES9000 system; MLC process; alignment; ceramic green sheet technology; continuous casting process; glass ceramic/Cu multilayer; green sheet properties; high end computers; internal interconnections; multilevel substrates; polymeric binder system; sheet microporosity; sheet preparation; slurry rheology; vias; Assembly; Casting; Ceramics; Copper; Glass; Rheology; Sheet materials; Slurries; Solvents; Surface morphology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1992. Proceedings., 42nd

Conference_Location

San Diego, CA

Print_ISBN

0-7803-0167-6

Type

conf

DOI

10.1109/ECTC.1992.204276

Filename

204276