• DocumentCode
    3088762
  • Title

    Analytic model of endurance degradation and its practical applications for operation scheme optimization in metal oxide based RRAM

  • Author

    Huang, Pei-Yu ; Chen, Bing ; Wang, Y.J. ; Zhang, F.F. ; Shen, L. ; Liu, Richard ; Zeng, Lang ; Du, Gang ; Zhang, Xiaobing ; Gao, Bingzhao ; Kang, J.F. ; Liu, X.Y. ; Wang, X.P. ; Weng, Bao Bin ; Tang, Yan Zhe ; Lo, Guo-Qiang ; Kwong, D.-L.

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing, China
  • fYear
    2013
  • fDate
    9-11 Dec. 2013
  • Abstract
    An analytic model for the endurance degradation of metal oxide based RRAM is presented for the first time. The endurance degradation behaviors under various operation modes can be predicted by the model, which were verified by the measured data in different devices. Furthermore, the 106 endurance for all 4-level resistance states in HfOX-based RRAM is demonstrated by using the proposed optimization operation scheme for multi-level data storage based on the model prediction. Guided by the model, a dynamic self-recovery operation scheme is developed to achieve more than 2 orders endurance enhancement at a high switching speed (10 ns).
  • Keywords
    MOS memory circuits; hafnium compounds; integrated circuit reliability; random-access storage; HfOx; dynamic self-recovery operation; endurance degradation; metal oxide based RRAM; model prediction; multilevel data storage; operation scheme optimization; Analytical models; Degradation; Integrated circuit modeling; Predictive models; Resistance; Switches; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2013 IEEE International
  • Conference_Location
    Washington, DC
  • Type

    conf

  • DOI
    10.1109/IEDM.2013.6724685
  • Filename
    6724685