DocumentCode
3088762
Title
Analytic model of endurance degradation and its practical applications for operation scheme optimization in metal oxide based RRAM
Author
Huang, Pei-Yu ; Chen, Bing ; Wang, Y.J. ; Zhang, F.F. ; Shen, L. ; Liu, Richard ; Zeng, Lang ; Du, Gang ; Zhang, Xiaobing ; Gao, Bingzhao ; Kang, J.F. ; Liu, X.Y. ; Wang, X.P. ; Weng, Bao Bin ; Tang, Yan Zhe ; Lo, Guo-Qiang ; Kwong, D.-L.
Author_Institution
Inst. of Microelectron., Peking Univ., Beijing, China
fYear
2013
fDate
9-11 Dec. 2013
Abstract
An analytic model for the endurance degradation of metal oxide based RRAM is presented for the first time. The endurance degradation behaviors under various operation modes can be predicted by the model, which were verified by the measured data in different devices. Furthermore, the 106 endurance for all 4-level resistance states in HfOX-based RRAM is demonstrated by using the proposed optimization operation scheme for multi-level data storage based on the model prediction. Guided by the model, a dynamic self-recovery operation scheme is developed to achieve more than 2 orders endurance enhancement at a high switching speed (10 ns).
Keywords
MOS memory circuits; hafnium compounds; integrated circuit reliability; random-access storage; HfOx; dynamic self-recovery operation; endurance degradation; metal oxide based RRAM; model prediction; multilevel data storage; operation scheme optimization; Analytical models; Degradation; Integrated circuit modeling; Predictive models; Resistance; Switches; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location
Washington, DC
Type
conf
DOI
10.1109/IEDM.2013.6724685
Filename
6724685
Link To Document