Title :
Array antenna integrated fan-out wafer level packaging (InFO-WLP) for millimeter wave system applications
Author :
Chung-Hao Tsai ; Jeng-Shien Hsieh ; Monsen Liu ; En-Hsiang Yeh ; Hsu-Hsien Chen ; Ching-Wen Hsiao ; Chen-Shien Chen ; Chung-Shi Liu ; Mirng-Ji Lii ; Chuei-Tang Wang ; Doug Yu
Author_Institution :
R&D, TSMC, Ltd., Hsinchu, Taiwan
Abstract :
Array antenna integrated with RF chip using InFO-WLP technology is proposed for millimeter wave system applications. Aperture-coupled patch antenna is designed on the fan-out molding compound (MC). The performance of single-element antenna is evaluated first and proved to have 5 dBi of gain. Meanwhile, the interconnect from chip to antenna feeding line is demonstrated to only have 0.7 dB loss, which can save 19 % PA output power compared with that of flip-chip package. Finally, the system performance of 4 × 4 antenna array integrated with RF chip on the InFO structure shows 14.7 dBi of array gain in a small form factor of 10 × 10 × 0.5 mm3.
Keywords :
MIMIC; antenna feeds; flip-chip devices; integrated circuit interconnections; microstrip antenna arrays; millimetre wave antenna arrays; wafer level packaging; 4 × 4 antenna array; InFO-WLP technology; MIMIC; RF chip; antenna feeding line; aperture-coupled patch antenna; chip interconnect; fan-out molding compound; flip-chip package; integrated fan-out wafer level packaging; loss 0.7 dB; millimeter wave array antenna; Antenna arrays; Arrays; Gain; Integrated circuit interconnections; Radio frequency; Silicon;
Conference_Titel :
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location :
Washington, DC
DOI :
10.1109/IEDM.2013.6724687
