Title :
Polyimide for thin film redistribution on glass-ceramic/copper multilevel substrates (ES9000 system)
Author :
Czornyj, G. ; Chen, K.R. ; Prada-Silva, G. ; Arnold, A. ; Souleotis, H. ; Kim, S. ; Ree, M. ; Volksen, W. ; Dawson, D. ; DiPietro, R.
Author_Institution :
IBM Technol. Products, Hopewell Junction, NY, USA
Abstract :
In 1991 IBM introduced a glass-ceramic substrate with thin-film redistribution as the first level package utilizing copper thin-film technology. The authors describe the development of a unique and novel polyimide, a derivative of PMDA-ODA, used in this substrate. The synthesis, processing, and material characterization are described. The discussion emphasizes the experimental techniques developed to fully characterize thin films (10-20 μm thick) of polyimide to ensure the manufacturability and reliability of the thin-film redistribution
Keywords :
IBM computers; hybrid integrated circuits; mainframes; multichip modules; polymer films; substrates; thin film circuits; 10 to 20 micron; Cu thin film technology; ES9000 system; first level package; glass-ceramic substrate; material characterization; multilevel substrates; polyimide; processing; synthesis; thin film redistribution; Adhesives; Copper; Dielectric thin films; Fabrication; Polyimides; Polymer films; Substrates; Thermal stresses; Transistors; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204278
