• DocumentCode
    3088827
  • Title

    Nanopore foams of high-temperature polymers

  • Author

    Labadie, J.W. ; Hedrick, J.L. ; Wakharkar, V. ; Hofer, D.C. ; Russell, T.P.

  • Author_Institution
    IBM Almaden Res. Center, San Jose, CA, USA
  • fYear
    1992
  • fDate
    18-20 May 1992
  • Firstpage
    688
  • Lastpage
    691
  • Abstract
    A method of generating high-temperature polymer foams with pore sizes in the nanometer regime was developed. The nanofoams were prepared by casting a block copolymer composed of a thermally stable and a thermally labile block, followed by a subsequent thermal treatment to degrade the labile material and generate the pores. The morphology of the block copolymer film was made up of a high-temperature polymer matrix, with the labile component as the dispersed phase. Thermolysis of the labile block affords pores where the size and shape of the pores are dictated by the initial copolymer morphology. Nanopore foam formation is described for triblock copolymers of poly(phenylquinoxaline), with poly(propylene oxide) as the labile block. Foam formation led to a 10-15% reduction in density, consistent with the poly(propylene oxide) composition, and a dielectric constant of 2.3. SAXS and TEM (transmission electron microscopy) measurements indicated pore sizes of approximately 10 nm
  • Keywords
    X-ray diffraction examination of materials; density of solids; foams; nanostructured materials; packaging; permittivity; polymer blends; porosity; porous materials; transmission electron microscope examination of materials; SAXS; TEM; block copolymer; casting; dielectric constant; high-temperature polymers; labile block; morphology; nanofoams; nanopore formation; packaging; poly(phenylquinoxaline); poly(propylene oxide); pore sizes; reduction in density; thermal treatment; thermolysis; triblock copolymers; Casting; Dielectric constant; Electrons; Morphology; Nanoporous materials; Polymer films; Polymer foams; Shape; Thermal degradation; Thermolysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1992. Proceedings., 42nd
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-0167-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1992.204279
  • Filename
    204279