Title :
Signal propagation over perforated reference planes in stripline interconnect structures
Author :
Senthinathan, R. ; Pence, W.E. ; Raver, N. ; Prince, J.L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Abstract :
An experimental and theoretical investigation of signal propagation in high-speed interconnect structures containing perforations in the reference planes is presented. Discontinuities of this type occur in many practical package designs and must be modeled correctly (in the time-domain) in order to account for the additional noise which is introduced on the signal line. To establish valid modeling techniques for this class of interconnects, measurements are made on two custom-designed test structures and compared with results obtained from simulation. The effect of the reference plane discontinuity is studied as a function of signal conductor height for a standard stripline configuration. Two- and three-dimensional parasitic extraction tools, along with full-wave electromagnetic solvers, are used to calculate the discontinuity element values. For both test structures, good correlation is obtained between measurements and modeling results. The value of different modeling approaches is discussed, and design guidelines for practical interconnect structures are proposed
Keywords :
S-parameters; circuit CAD; equivalent circuits; microstrip lines; modules; packaging; strip lines; time-domain reflectometry; transmission line theory; S-parameters; custom-designed test structures; design guidelines; equivalent circuit; full-wave electromagnetic solvers; high-speed interconnect structures; modeling techniques; parasitic extraction tools; perforated reference planes; signal conductor height; signal propagation; stripline interconnect structures; time domain reflectometry; Conductors; Electromagnetic measurements; Electronics packaging; Guidelines; Integrated circuit interconnections; Signal design; Stripline; Testing; Time domain analysis; Transmission lines;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204283