DocumentCode :
3088965
Title :
Advantage of (001)/<100> oriented channels in biaxially- and uniaxially strained-Ge-on-insulator pMOSFETs with NiGe metal source/drain
Author :
Ikeda, Ken-ichi ; Moriyama, Y. ; Kamimuta, Y. ; Ono, M. ; Irisawa, T. ; Oda, Masaomi ; Kurosawa, Etsuo ; Tezuka, Taro
Author_Institution :
Collaborative Res. Team Green Nanoelectron. Center (GNC), Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan
fYear :
2013
fDate :
9-11 Dec. 2013
Abstract :
We compared current drivability between (001)/<;100> and (001)/<;110> strained Ge-on-insulator pMOSFETs under biaxial and uniaxial stress. Higher intrinsic transconductance (gm, int) was experimentally demonstrated for the first time in the (001)/<;100> devices with a gate length (Lg) less than 100 nm under the both strain conditions, although this is not the case for the long-channel devices. This is possibly attributable to more significant non-parabolicity of the valence band (VB) dispersion, i.e., heavier effective mass at energy apart from the VB minimum, along <;110> than along <;100>. It is also found that the parasitic resistance (RSD) governed by the contact resistance between the NiGe-source and the strained-Ge channel is lower along <;100> direction than the counterpart. As a result, higher drive current was observed for a <;100> device with Lg of 55 nm under both the biaxial-(644 μA/μm) and uniaxial stress (536 μA/μm) at Vd = -0.5 V than for <;110> counterpart, although mobility was highest in the <;110> channel under the uniaxial stress.
Keywords :
MOSFET; contact resistance; elemental semiconductors; germanium; valence bands; Ge; biaxial stress; biaxially-strained-Ge-on-insulator pMOSFET; contact resistance; current drivability; drive current; gate length; intrinsic transconductance; long-channel devices; metal source/drain; parasitic resistance; size 55 nm; strain conditions; uniaxial stress; uniaxially strained-Ge-on-insulator pMOSFET; valence band dispersion; voltage -0.5 V; Dispersion; Hafnium compounds; Logic gates; MOSFET; Silicon; Strain; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location :
Washington, DC
Type :
conf
DOI :
10.1109/IEDM.2013.6724695
Filename :
6724695
Link To Document :
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