Title :
Factors governing the loop profile in Au bonding wire
Author :
Ohno, Yasuhide ; Ohzeki, Yoshio ; Aso, Toshiro ; Kitamura, Osamu
Author_Institution :
Nippon Steel Corp., Japan
Abstract :
It is found by studying the factors governing the loop profile in Au bonding wires that the thermal history in forming the ball caused the observed V-shaped hardness distribution in the heat affected zone. It is proved by combining calculation and simulation that the minimum hardness portion is a dominant factor governing the loop height. As recent LSI packaging is becoming thinner and thinner, a low profile wire is required for the bonding wire, which can be developed by utilizing this approach
Keywords :
gold; hardness; integrated circuit technology; large scale integration; lead bonding; packaging; Au bonding wire; LSI packaging; V-shaped hardness distribution; bonding wire; heat affected zone; loop profile; low profile wire; simulation; Bonding; Doping; Gold; Grain size; Large scale integration; Mechanical factors; Neck; Packaging; Resins; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204313
