DocumentCode :
3089532
Title :
High performance closed-channel cooling system using multi-channel electro-osmotic flow pumps for 3D-ICs
Author :
Kudo, Hiroyuki ; Oguri, Y. ; Tsukune, A. ; Kim, Yong Sin ; Kitada, H. ; Fjimoto, K. ; Kinefuchi, I. ; Matsumoto, Yuki ; Ohba, Tsuyoshi
Author_Institution :
Dept. of Mech. Eng., Univ. of Tokyo, Tokyo, Japan
fYear :
2013
fDate :
9-11 Dec. 2013
Abstract :
A multi-channel electro-osmotic flow (EOF) implemented to the closed-channel cooling system (C3S) has been developed for thermal management of stacked chips (3D-ICs). The EOF pump, which was fabricated using MEMS technology, provided driving capabilities of fluid flow through the micro channel at the Pmax of 1 × 104 Pa and Qmax of 38 μl/min. Cooling capability as high as 140 W/cm2 was demonstrated for the first time.
Keywords :
cooling; electrophoresis; microchannel flow; micropumps; osmosis; thermal management (packaging); three-dimensional integrated circuits; 3D-IC; EOF pump; MEMS technology; closed-channel cooling system; cooling capability; fluid flow; microchannel; multichannel electro-osmotic flow pumps; stacked chips; thermal management; Coolants; Fluids; Heating; Pumps; Silicon; Through-silicon vias;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location :
Washington, DC
Type :
conf
DOI :
10.1109/IEDM.2013.6724720
Filename :
6724720
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3089532
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