• DocumentCode
    3089532
  • Title

    High performance closed-channel cooling system using multi-channel electro-osmotic flow pumps for 3D-ICs

  • Author

    Kudo, Hiroyuki ; Oguri, Y. ; Tsukune, A. ; Kim, Yong Sin ; Kitada, H. ; Fjimoto, K. ; Kinefuchi, I. ; Matsumoto, Yuki ; Ohba, Tsuyoshi

  • Author_Institution
    Dept. of Mech. Eng., Univ. of Tokyo, Tokyo, Japan
  • fYear
    2013
  • fDate
    9-11 Dec. 2013
  • Abstract
    A multi-channel electro-osmotic flow (EOF) implemented to the closed-channel cooling system (C3S) has been developed for thermal management of stacked chips (3D-ICs). The EOF pump, which was fabricated using MEMS technology, provided driving capabilities of fluid flow through the micro channel at the Pmax of 1 × 104 Pa and Qmax of 38 μl/min. Cooling capability as high as 140 W/cm2 was demonstrated for the first time.
  • Keywords
    cooling; electrophoresis; microchannel flow; micropumps; osmosis; thermal management (packaging); three-dimensional integrated circuits; 3D-IC; EOF pump; MEMS technology; closed-channel cooling system; cooling capability; fluid flow; microchannel; multichannel electro-osmotic flow pumps; stacked chips; thermal management; Coolants; Fluids; Heating; Pumps; Silicon; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2013 IEEE International
  • Conference_Location
    Washington, DC
  • Type

    conf

  • DOI
    10.1109/IEDM.2013.6724720
  • Filename
    6724720
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3089532