• DocumentCode
    3089611
  • Title

    HAST evaluation of organic liquid IC encapsulants using Sandia´s assembly test chips

  • Author

    Emerson, John A. ; Peterson, David W. ; Sweet, James N.

  • Author_Institution
    Sandia Nat. Lab., Albuquerque, NM, USA
  • fYear
    1992
  • fDate
    18-20 May 1992
  • Firstpage
    951
  • Lastpage
    956
  • Abstract
    Accelerated aging (HAST) experiments were conducted with special-purpose corrosion test chips (ATCs) in both bare die form and with various liquid encapsulants: epoxy, silicone and silicone elastomer, or silicone gel. The purpose of the experiment was to show what incremental improvement in die corrosion resistance was provided by the encapsulants and to determine the failure modes for the two types of samples. The test conditions were 140°C/85% RH (relative humidity) and +40-V bias on outer tracks with respect to the center track. In the case of nonencapsulated parts, median lifetimes of about 1000 h were observed for the best passivations, with the predominant failure mode being triple track corrosion on the die. In the case of the encapsulated parts, the failure mode depended on the encapsulant type. Several of the silicone gel materials showed excellent HAST (high accelerated stress testing) performance, with only a few percent failures at the 1 100-h point
  • Keywords
    ageing; circuit reliability; corrosion testing; encapsulation; environmental testing; failure analysis; humidity; integrated circuit testing; moisture; organic compounds; 140 degC; 40 V; HAST evaluation; accelerated ageing; assembly test chips; corrosion test chips; die corrosion resistance; epoxy; failure modes; high accelerated stress testing; organic liquid IC encapsulants; silicone elastomer; silicone gel; triple track corrosion; Accelerated aging; Assembly; Coatings; Humidity; Integrated circuit testing; Life estimation; Life testing; Moisture; Protection; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1992. Proceedings., 42nd
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-0167-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1992.204320
  • Filename
    204320