DocumentCode
3089714
Title
A multichip package for high-speed logic die
Author
Myszka, Edward G. ; Casey, Allison ; Trent, Jim
Author_Institution
Motorola Inc., Schaumburg, IL, USA
fYear
1992
fDate
18-20 May 1992
Firstpage
991
Lastpage
996
Abstract
An attempt to develop a multichip module infrastructure is reported. Design, assembly, and test methodologies were developed and implemented. Several prototype modules were fabricated to accommodate six flip chip mounted 463 I/O H4C 123 gate array logic die. These modules were used as test vehicles to verify the effectiveness of the development infrastructure
Keywords
application specific integrated circuits; flip-chip devices; logic arrays; multichip modules; ASIC logic; MCM infrastructure; assembly; design; flip chip mounted; high-speed logic die; multichip package; prototype modules; test methodologies; Application specific integrated circuits; Costs; Design automation; Electromagnetic analysis; Electronic equipment manufacture; Electronics packaging; Frequency; Logic; Multichip modules; Packaging machines;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location
San Diego, CA
Print_ISBN
0-7803-0167-6
Type
conf
DOI
10.1109/ECTC.1992.204326
Filename
204326
Link To Document