A new liquid encapsulant for IC packaging

The new SYCAR resin is shown to have the desirable characteristics for a liquid encapsulant. Unlike epoxy-based encapsulants, this resin consists of a silicon-carbon backbone which is highly crosslinked during the cure reaction. The desirable characteristics of this resin include a low level of ionic contamination, low moisture absorption, high glass transition temperature, excellent dispensability, and long shelf life. Package level reliability results indicated that the SYCAR encapsulant outperformed the leading domestic and Japanese encapsulants and met the 144 h of autoclave, 1000 h of bias humidity, and 1000 cycles of thermal shock requirements for mold compounds