Title :
A new liquid encapsulant for IC packaging
Author :
Pennisi, Robert ; Gold, Glenn
Author_Institution :
Motorola Inc., Ft. Lauderdale, FL, USA
Abstract :
The new SYCAR resin is shown to have the desirable characteristics for a liquid encapsulant. Unlike epoxy-based encapsulants, this resin consists of a silicon-carbon backbone which is highly crosslinked during the cure reaction. The desirable characteristics of this resin include a low level of ionic contamination, low moisture absorption, high glass transition temperature, excellent dispensability, and long shelf life. Package level reliability results indicated that the SYCAR encapsulant outperformed the leading domestic and Japanese encapsulants and met the 144 h of autoclave, 1000 h of bias humidity, and 1000 cycles of thermal shock requirements for mold compounds
Keywords :
encapsulation; integrated circuit technology; polymer melts; IC packaging; SYCAR resin; dispensability; high glass transition temperature; liquid encapsulant; long shelf life; low moisture absorption; package level reliability; Absorption; Contamination; Electric shock; Glass; Humidity; Integrated circuit packaging; Moisture; Resins; Spine; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204329
