Title :
A new moisture resistant liquid encapsulant
Author :
Bard, John K. ; Brady, Richard L.
Author_Institution :
Hercules Inc., Wilmington, DE, USA
Abstract :
A novel silicon-carbon thermosetting resin has been developed for semiconductor encapsulant applications. The resin and liquid encapsulant formulations have exceptional moisture resistance, good ionic purity, excellent electrical properties, long pot life, and good thermal and mechanical properties. The new liquid encapsulant can provide improved reliability, and should be considered for use in glob top and potting applications. Possible areas of use include encapsulation for chip on board (COB), tape automated bonding (TAB), chip carriers, and multichip modules
Keywords :
encapsulation; integrated circuit technology; polymer melts; SYCAR; TAB; chip carriers; chip on board; improved reliability; ionic purity; liquid encapsulant; long pot life; moisture resistant; multichip modules; semiconductor encapsulant; thermosetting resin; Chemistry; Electric resistance; Encapsulation; Materials reliability; Moisture; Polymers; Resins; Semiconductor materials; Temperature; Thermal resistance;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204330
