Title :
Liquid dropping resin for IC encapsulant
Author :
Ozawa, S. ; Mizuno, M.
Author_Institution :
Sumitomo Bakelite Co. Ltd., Tochigi, Japan
Abstract :
The authors report on the development of a liquid epoxy resin for bare-chip IC encapsulation on organic substrate. This resin is characterized by low stress and high adhesion strength at elevated temperature. This resin can be applied to many types of bare-chip encapsulation on organic substrate going through the soldering process
Keywords :
adhesion; encapsulation; filled polymers; integrated circuit technology; polymer melts; reliability; IC encapsulant; bare-chip IC encapsulation; elevated temperature; filled polymer; high adhesion strength; liquid dropping resin; liquid epoxy resin; low stress; organic substrate; soldering; Adhesives; Conductivity; Electronic packaging thermal management; Electronics packaging; Internal stresses; Passivation; Resins; Soldering; Testing; Thermal resistance;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204332
