DocumentCode
3089858
Title
Economic impact of processing technologies on thin film MCMs
Author
Ng, Lee H.
Author_Institution
IBIS Associates Inc., Wellesley, MA, USA
fYear
1992
fDate
18-20 May 1992
Firstpage
1042
Lastpage
1045
Abstract
The author investigates the economic impact of processing technologies on the cost of MCM (multichip module) substrates using a technique called technical cost modeling. Using the technique and data collected from industry, a thin film MCM substrate technical cost model was developed. The model is used to evaluate the economics of different processing options for dielectric deposition and the use of photosensitive versus nonphotosensitive polyimides for via formation. The results have strong implications for both the users and manufacturers of MCMs
Keywords
costing; integrated circuit manufacture; multichip modules; substrates; thin film circuits; dielectric deposition; economic impact; nonphotosensitive polyimides; photosensitive polyimides; processing technologies; technical cost modeling; thin film MCMs; via formation; Circuits; Costs; Dielectric substrates; Dielectric thin films; Fuel economy; Manufacturing industries; Manufacturing processes; Polyimides; Transistors; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location
San Diego, CA
Print_ISBN
0-7803-0167-6
Type
conf
DOI
10.1109/ECTC.1992.204334
Filename
204334
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