Title :
Economic impact of processing technologies on thin film MCMs
Author_Institution :
IBIS Associates Inc., Wellesley, MA, USA
Abstract :
The author investigates the economic impact of processing technologies on the cost of MCM (multichip module) substrates using a technique called technical cost modeling. Using the technique and data collected from industry, a thin film MCM substrate technical cost model was developed. The model is used to evaluate the economics of different processing options for dielectric deposition and the use of photosensitive versus nonphotosensitive polyimides for via formation. The results have strong implications for both the users and manufacturers of MCMs
Keywords :
costing; integrated circuit manufacture; multichip modules; substrates; thin film circuits; dielectric deposition; economic impact; nonphotosensitive polyimides; photosensitive polyimides; processing technologies; technical cost modeling; thin film MCMs; via formation; Circuits; Costs; Dielectric substrates; Dielectric thin films; Fuel economy; Manufacturing industries; Manufacturing processes; Polyimides; Transistors; Virtual manufacturing;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204334
