DocumentCode :
3090620
Title :
Ultra-high Q.f product laterally-coupled AlN/silicon and AlN/sapphire High Overtone Bulk Acoustic wave Resonators
Author :
Reinhardt, Andreas ; Delaye, M.T. ; Abergel, J. ; Kovacova, Veronika ; Allain, M. ; Andreutti, L. ; Mercier, D. ; Georges, J. ; Tomaso, F. ; Lassagne, P.P. ; Defay, E. ; Chretien, N. ; Baron, T. ; Martin, G. ; Lebrasseur, Eric ; Ballandras, S. ; Chommelou
Author_Institution :
LETI, CEA, Grenoble, France
fYear :
2013
fDate :
21-25 July 2013
Firstpage :
1922
Lastpage :
1925
Abstract :
We investigate the use of laterally-coupled High Overtone Bulk Acoustic Resonators (HBAR) based on AlN thin films sputtered on silicon and sapphire substrates in order to target an operation frequency between 2 and 5 GHz. Being tightly coupled, they generate an extremely narrow bandwidth, assimilated to a single resonance whose unloaded quality factors reach respectively 3,300 and 2,000 at 2.5 and 4.4 GHz on silicon substrates and 25,000 at both frequencies on sapphire substrates. The later lead to Q.f factors close to 1.1 1014 Hz, reaching after twenty years the record established by Kline and Lakin [1]. More interestingly, for filters fabricated on Sapphire substrates, quality factors do not scale with frequency, indicating that viscoelastic losses in Sapphire are not yet the most limiting factor. Indeed, we demonstrate that a compromise needs to be drawn between insertion loss and quality factor in such structures.
Keywords :
III-V semiconductors; Q-factor; acoustic resonator filters; aluminium compounds; bulk acoustic wave devices; elemental semiconductors; sapphire; silicon; wide band gap semiconductors; Al2O3; Si; frequency 2 GHz; frequency 2.5 GHz; frequency 4.4 GHz; frequency 5 GHz; insertion loss; laterally coupled high overtone bulk acoustic wave resonators; single resonance; thin films; ultrahigh Qf product; unloaded quality factors; viscoelastic losses; Frequency measurement; III-V semiconductor materials; Insertion loss; Q-factor; Resonant frequency; Silicon; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2013 IEEE International
Conference_Location :
Prague
ISSN :
1948-5719
Print_ISBN :
978-1-4673-5684-8
Type :
conf
DOI :
10.1109/ULTSYM.2013.0490
Filename :
6724771
Link To Document :
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