Title :
Technology trends for future low cost phased arrays
Author :
Sarcione, M. ; Puzella, A.
Author_Institution :
Raytheon Company, Sudbury, United States
Abstract :
The next generation of active electronically scanned arrays (AESAs) is dependent upon many technology and application pulls and the pushes. RF and manufacturing technologies are key elements of achieving more affordable phased arrays in support of both military and commercial applications. Advanced, evolving, mature and even revolutionary device, material and packaging technologies are making significant strides for lowering the cost of phased arrays. To date, phased array usage has been limited to high end military and commercial applications. That´s about to change with the evolution of more affordable AESA architectures that take advantage of RF microelectronics, surface mount RF packaging and new architectures focused on reducing the high cost drivers. New Panel AESA approaches promise a savings of more than 50% since the initial nearly 20 years ago.
Keywords :
Costs; Electronics packaging; Laboratories; Manufacturing; Microelectronics; Phase change materials; Phased arrays; Radio frequency;
Conference_Titel :
Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4244-6056-4
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2010.5515004