Title :
Thermal Stability Analysis of Disconnect Switch Based on FEM
Author :
Zhang, Rongling ; Li, Bo ; Liang, Huimin ; Zhai, Guofu ; Wu, Zuobin ; Shi, Yutao ; Wang, Zhihui
Author_Institution :
Sch. of Electr. Eng. & Autom., Harbin Inst. of Technol., Harbin, China
Abstract :
Working performance of disconnect switch is affected by maximum permissible temperature exceeding which is caused by the heat loss of resistance. 2-D finite element analysis model of disconnect switch is established. It is used for electrical-thermal coupled field simulation analysis for ensuring its safety and reliability. Firstly, the contact depth and contact radius of disconnect switch in the closed state is calculated. Then, steady-state temperature rise and transient temperature rise of the disconnect switch are simulated. The average temperature rise, temperature distribution and contact temperature versus time curve are presented. Based on the results of simulation, which are compared with the experimental results, thermal stability is analyzed. The analysis result is of academic and practical value for reliability design of disconnect switch.
Keywords :
electrical contacts; finite element analysis; temperature distribution; thermal analysis; thermal stability; 2D finite element analysis model; FEM; average temperature rise; contact temperature; disconnect switch; electrical-thermal coupled field simulation analysis; heat loss of resistance; maximum permissible temperature; steady-state temperature rise; temperature distribution; thermal stability analysis; time curve; transient temperature rise; Contacts; Finite element methods; Load modeling; Resistance heating; Switches; Temperature distribution; Thermal stability; FEM; disconnect switch; thermal stability;
Conference_Titel :
Pervasive Computing Signal Processing and Applications (PCSPA), 2010 First International Conference on
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-8043-2
Electronic_ISBN :
978-0-7695-4180-8
DOI :
10.1109/PCSPA.2010.299
