Title :
Properties and processing of AVATRELTM as a high performance dielectric
Author :
Grove, N.R. ; Kohl, P.A. ; Bidstrup-Allen, S.A. ; Shick, R.A. ; Goodall, B.L. ; Jayaraman, S.
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
The development of low dielectric constant materials for interlevel dielectrics is necessary to meet the demands of the microelectronics industry. A family of materials derived from polynorbornene is being developed as interlevel dielectrics. These materials are functionalized to give excellent adhesion, good elongation to break, and low stress while maintaining their low dielectric constant. In order to understand the effect of the functionalization on the properties of the polymer, a series of materials with different compositions are being investigated. The properties of these films will be used to optimize the cyclic polyolefin composition
Keywords :
adhesion; dielectric thin films; multichip modules; permittivity; polymer films; AVATREL; MCM; adhesion; cyclic polyolefin; high performance dielectric; interlevel dielectrics; low dielectric constant materials; polymer; polynorbornene; Adhesives; Dielectric constant; Dielectric materials; Dielectric substrates; Inorganic materials; Microelectronics; Moisture; Polyimides; Polymer films; Thermal stability;
Conference_Titel :
Multichip Modules, 1997., International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-3787-5
DOI :
10.1109/ICMCM.1997.581179
