DocumentCode :
309172
Title :
Design considerations for using integrated passive components
Author :
Parkerson, James Patrick ; Schaper, Leonard W. ; Lenihan, Timothy G.
Author_Institution :
High Density Electron. Center, Arkansas Univ., Fayetteville, AR, USA
fYear :
1997
fDate :
2-4 Apr 1997
Firstpage :
345
Lastpage :
350
Abstract :
The demand for smaller, lighter, faster and less expensive electronic products has led to the development of a laminate multi-chip module (MCM-L) process that contains integrated passive components. The University of Arkansas (UA) cooperated with Sheldahl Corporation and the Rensselaer Polytechnic Institute (RPI), as a member of the DARPA funded MCM-L consortium, to develop this integrated passive MCM-L (IPMCM-L) process. It contains resistors, capacitors and inductors integrated in a flexible film. Parasitic extraction, modeling, and simulation must be performed to effectively utilize this process for high performance circuits. A design methodology addressing these issues is discussed along with the process layers and example device layouts
Keywords :
integrated circuit design; multichip modules; MCM-L; capacitors; design; device layout; electronic product; flexible film; high performance circuit; inductors; integrated passive components; laminate multi-chip module; modeling; parasitic extraction; process layer; resistors; simulation; Aluminum; Capacitors; Conductive films; Contact resistance; Copper; Dielectric substrates; Equivalent circuits; Power distribution; Resistors; Routing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1997., International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-3787-5
Type :
conf
DOI :
10.1109/ICMCM.1997.581206
Filename :
581206
Link To Document :
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