DocumentCode :
309173
Title :
Glass ceramics functional substrate development
Author :
Tagami, Kenji ; Kubo, Takanori ; Makihara, Chihiro ; Tanahashi, Shigeo ; Emura, Hideo ; Tanaka, June ; Sueyoshi, Takash ; Kunimatsu, Yasuyosh ; Sigliano, Richard ; Nelson, Chuck
Author_Institution :
Yamashita KoKubu Kagoshima, Japan
fYear :
1997
fDate :
2-4 Apr 1997
Firstpage :
363
Lastpage :
370
Abstract :
Operating frequencies required for today´s wireless telecommunication electronics have increased from hundreds of megahertz to a few gigahertz (GHz). The use of the GHz band is enabled in the wireless market by passive and active components in microwave integrated circuits (MIC) or monolithic microwave integrated circuits (MMIC) packages which meet the need for high performance and lower cost. There are still a few technical problems that need to be resolved in these packages. Among these are high Q inductors and capacitors which cannot be built cost effectively in the sizes required. Technological developments have yielded new low temperature glass-ceramic materials which cost effectively incorporate integrated passive components. These integrated components include inductors, capacitors, impedance matching SAW filter circuits and band pass filters. This presentation describes the development of this material and design of a test vehicle to determine applicability in to high frequency wireless applications
Keywords :
MMIC; UHF integrated circuits; ceramics; glass; impedance matching; multichip modules; substrates; LTCC; glass ceramics functional substrate; high frequency wireless applications; integrated passive components; low temperature glass-ceramic materials; Capacitors; Ceramics; Costs; Frequency; Glass; Inductors; Integrated circuit packaging; MMICs; Microwave integrated circuits; Monolithic integrated circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1997., International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-3787-5
Type :
conf
DOI :
10.1109/ICMCM.1997.581209
Filename :
581209
Link To Document :
بازگشت