DocumentCode :
309174
Title :
Designing a complex multi-chip module with high power requirements for an aerospace environment
Author :
Clarke, Robert A. ; Glahn, Timothy J.
Author_Institution :
Teledyne Electron. Technol., Los Angeles, CA, USA
fYear :
1997
fDate :
2-4 Apr 1997
Firstpage :
371
Lastpage :
378
Abstract :
Raytheon E-Systems has designed a Programmable Digital Receiver (PDRx) Multi-chip Module (MCM) for use in aerospace applications. The PDRx MCM is able to overcome the technical limitations of analog receivers without the size, power, and weight penalties typically associated with digital receiver technology. The PDRx design is comprised of four digital receiver channels accepting 16-bit-wide data streams at a frequency of 33 MHz (roughly a 10 MHz bandwidth per channel) with user programmable functions such as bandshifting, filtering, and postprocessing. The PDRx design is made possible through the use of highly efficient DSP algorithms implemented in VLSI technology, coupled with the processing power of 100 Mflops. The paper details solutions to some of the mechanical issues encountered in this design. These issues include the substrate design, ringframe design, thermal design, and lid concerns of the MCM
Keywords :
avionics; hybrid integrated circuits; integrated circuit design; integrated circuit packaging; multichip modules; receivers; substrates; 10 MHz; 100 MFLOPS; 16-bit-wide data streams; 33 MHz; AlN; PDRx MCM; Raytheon E-Systems; VLSI technology; aerospace environment; bandshifting; complex multi-chip module; digital receiver channels; dual cavity AlN package; filtering; high power requirements; highly efficient DSP algorithms; lid concerns; mechanical issues; postprocessing; programmable digital receiver MCM design; quad flatpack design; ringframe design; substrate design; thermal design; user programmable functions; Aerospace electronics; Aerospace engineering; Bonding; Capacitors; Design engineering; Geometry; Integrated circuit packaging; Manufacturing; Power engineering and energy; Resistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1997., International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-3787-5
Type :
conf
DOI :
10.1109/ICMCM.1997.581210
Filename :
581210
Link To Document :
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