• DocumentCode
    309179
  • Title

    Low cost solder flip chip

  • Author

    Rinne, Glenn A. ; Magill, Paul A.

  • Author_Institution
    MCNC Interconnection & Packaging Technol., Research Traingle Park, NC, USA
  • fYear
    1997
  • fDate
    9-12 Mar 1997
  • Firstpage
    113
  • Lastpage
    114
  • Abstract
    Since the advent of flip chip packaging technology in the solid logic technology (SLT) of IBM in the early 1960s, a great deal of thought and energy has been invested toward making flip chip cost competitive with wirebonding. While this goal has been occasionally met in the intervening years, the relentless progress of wirebond technology has repeatedly regained the advantage
  • Keywords
    flip-chip devices; soldering; IBM; packaging; solder flip chip; solid logic technology; wire bonding; Aluminum; Costs; Etching; Flip chip; Integrated circuit interconnections; Logic; Packaging; Protection; Solids; Surface tension;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials. Proceedings., 3rd International Symposium on
  • Conference_Location
    Braselton, GA
  • Print_ISBN
    0-7803-3818-9
  • Type

    conf

  • DOI
    10.1109/ISAPM.1997.581270
  • Filename
    581270
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=309179