Title :
The effect of substrate materials on the thermo-mechanical behavior of multilayered structures
Author :
Dunne, Rajiv C. ; Sitaraman, Suresh K.
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
At the Packaging Research Center, research on a new MCM DL technology called “SLIM (Single Level Integrated Module)” is currently being pursued This consists of a multilayered substrate, which includes passive layers such as capacitor, inductor and resistor layers, in addition to the power, X-Y signal and ground layers. The present study focuses on predicting the substrate warpage and interfacial stress-strain distribution of this complex multilayered structure under uniform thermal loading. The effect of some key parameters such as base layer thickness, base layer material, interlayer dielectric material, and thermal load has been studied on an idealized model to understand the thermo-mechanical response of the substrate. Preliminary design/material recommendations are suggested for enhanced thermo-mechanical integrity of the integrated substrate
Keywords :
ceramics; dielectric thin films; elastic moduli; finite element analysis; interface phenomena; laminates; multichip modules; plastic packaging; polymer films; stress-strain relations; substrates; thermal expansion; MCM DL technology; SLIM; X-Y signal layers; base layer material; base layer thickness; ceramic; enhanced thermo-mechanical integrity; epoxy-glass laminate; ground layers; idealized model; interfacial stress-strain distribution; interlayer dielectric material; multilayered structures; passive layers; polymer materials; power layers; single level integrated module; substrate materials effect; substrate warpage; thermo-mechanical behavior; uniform thermal loading; Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Mechanical engineering; Shearing; Thermal expansion; Thermal loading; Thermal stresses; Thermomechanical processes; Transistors;
Conference_Titel :
Advanced Packaging Materials. Proceedings., 3rd International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-3818-9
DOI :
10.1109/ISAPM.1997.581277
