Title :
The use of multichip module technology for power electronics miniaturization and packaging
Author :
Burgers, K.C. ; Olejniczak, K.J. ; Ang, S.S. ; Porter, E.
Author_Institution :
Dept. of Electr. Eng., Arkansas Univ., Fayetteville, AR, USA
Abstract :
This paper describes the design and fabrication of a highly integrated, intelligent, integral horsepower, three-phase induction motor drive based on multichip module (MCM) technology. This solid-state controller-known as a multichip power module (MCPM)-uses known good die to obtain minimal footprint, volume, and mass, while maximizing efficiency, reliability, and manufacturability
Keywords :
induction motor drives; integrated circuit packaging; multichip modules; power electronics; reliability; variable speed drives; efficiency maximisation; footprint minimisation; integral horsepower; intelligent drive; manufacturability maximisation; mass minimisation; multichip module technology; multichip power module; packaging; power electronics miniaturization; reliability maximisation; solid-state controller; three-phase induction motor drive; variable speed drives; volume minimisation; Communication system control; Consumer electronics; Electronics packaging; Induction motor drives; Manufacturing; Multichip modules; Power electronics; Power system reliability; Pulse width modulation inverters; Solid state circuits;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 1997. APEC '97 Conference Proceedings 1997., Twelfth Annual
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-3704-2
DOI :
10.1109/APEC.1997.581431
