Title :
A versatile electrothermal model of an integrated full bridge device taking into account various boundary conditions
Author :
Schepp, Oliver ; Lenz, Michael
Author_Institution :
Solid State Electron. Lab., Tech. Univ. Darmstadt, Germany
Abstract :
The authors present an analytical electrothermal model of an integrated full-bridge power converter for PSpice. It combines a thermal RC-network including thermal coupling between the DMOS devices with an electrothermal model for each DMOSFET. A comparison between thermal simulation and FEM analysis of an commercially available module is given and, as an application example, the authors show the simulation of switching on a DC motor with the full-bridge device and an approach to include basic printed circuit board characteristics into the simulation
Keywords :
SPICE; bridge circuits; circuit analysis computing; field effect transistor switches; power MOSFET; power convertors; power field effect transistors; power semiconductor switches; semiconductor device models; software packages; thermal analysis; DC motor characteristics; DMOS devices; DMOSFET; FEM analysis; PSpice; computer simulation; electrothermal model; full-bridge power converter; printed circuit board characteristics; thermal RC-network; thermal coupling; thermal simulation; Analytical models; Boundary conditions; Bridges; Circuit simulation; DC motors; Electrothermal effects; Power integrated circuits; Switches; Temperature; Thermal loading;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 1997. APEC '97 Conference Proceedings 1997., Twelfth Annual
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-3704-2
DOI :
10.1109/APEC.1997.581452
