• DocumentCode
    3092
  • Title

    System Identification and Semiactive Control of a Squeeze-Mode Magnetorheological Damper

  • Author

    Chih-Jer Lin ; Her-Terng Yau ; Chun-Ying Lee ; Kai-Hung Tung

  • Author_Institution
    Grad. Inst. of Autom. & Technol., Nat. Taipei Univ. of Technol., Taipei, Taiwan
  • Volume
    18
  • Issue
    6
  • fYear
    2013
  • fDate
    Dec. 2013
  • Firstpage
    1691
  • Lastpage
    1701
  • Abstract
    The main goal of this investigation is to establish modeling of a squeeze-mode magnetorheological (MR) damper and to design a semiactive fuzzy controller for vibration reduction. To model the MR damper, the Bouc-Wen model has been used in many past studies. However, using the Bouc-Wen model to characterize the squeeze-mode MR damper needs a lookup table of system parameters for the application with various amplitudes and frequencies. Therefore, a biviscosity model is proposed to describe this squeeze-mode MR damper. In addition, genetic-algorithm-based optimization is used to evaluate the parameters of the system. To reduce the vibration of the structure, a semiactive fuzzy controller using the MR damper is presented for the structure vibration at various frequencies. To check the consistency of the proposed fuzzy controller, the real-time implementation validated the performance of the controller.
  • Keywords
    control system synthesis; fuzzy control; genetic algorithms; identification; magnetorheology; shock absorbers; structural engineering; vibration control; Bouc-Wen model; MR damper; biviscosity model; genetic-algorithm-based optimization; semiactive fuzzy controller design; squeeze-mode magnetorheological damper; structure vibration reduction; system identification; system parameter lookup table; Damping; Fuzzy control; Genetic algorithms; Rheology; Shock absorbers; Vibration control; Biviscosity model; Bouc–Wen model; fuzzy control; genetic algorithm (GA); magnetorheological (MR) damper; squeeze mode;
  • fLanguage
    English
  • Journal_Title
    Mechatronics, IEEE/ASME Transactions on
  • Publisher
    ieee
  • ISSN
    1083-4435
  • Type

    jour

  • DOI
    10.1109/TMECH.2013.2279852
  • Filename
    6595023