DocumentCode
309247
Title
On-chip analog output response compaction
Author
Renovell, M. ; Azais, F. ; Bertrand, Y.
Author_Institution
Lab. d´´Inf., LIRMM, Montpellier, France
fYear
1997
fDate
17-20 Mar 1997
Firstpage
568
Lastpage
572
Abstract
In this paper, we propose a technique for on-chip analog output response compaction in order to implement self-test capabilities in analog and mixed-signal integrated circuits. The integration function is identified as a powerful analog compression scheme and an analog signature analyzer is proposed. The op amp-based implementation allows one to define single and multiple-input versions. The multiple-input analyzer permits the monitoring of some extra internal nodes in addition to the classical output nodes, or the concurrent control of both voltage and current levels. This ability leads to an improvement of the circuit testability and consequently, the on-chip response evaluation gives a higher fault coverage than the off-chip one
Keywords
automatic testing; built-in self test; data compression; integrated circuit testing; mixed analogue-digital integrated circuits; analog compression scheme; analog output response compaction; analog signature analyzer; circuit testability; concurrent control; fault coverage; integration function; internal nodes; mixed-signal integrated circuits; multiple-input version; on-chip response evaluation; op amp-based implementation; self-test capabilities; single-input version; Analog circuits; Automatic testing; Built-in self-test; CMOS technology; Circuit faults; Circuit testing; Compaction; Digital circuits; Monitoring; Robots;
fLanguage
English
Publisher
ieee
Conference_Titel
European Design and Test Conference, 1997. ED&TC 97. Proceedings
Conference_Location
Paris
ISSN
1066-1409
Print_ISBN
0-8186-7786-4
Type
conf
DOI
10.1109/EDTC.1997.582418
Filename
582418
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