DocumentCode
3092559
Title
Thermal studies of a plate bundle waveguide for use as an ultrasonic flow meter buffer
Author
Laws, M. ; Ramadas, S.N. ; Dixon, Sam
Author_Institution
Dept. of Phys., Univ. of Warwick, Coventry, UK
fYear
2013
fDate
21-25 July 2013
Firstpage
1618
Lastpage
1621
Abstract
The thermal properties of a buffer waveguide, for use in flow measurement, have been studied, through the use of modeling and experimentally. We have observed the effects of thermal gradients within the device, particularly on the velocity of the propagating wave modes. Additionally, we have investigated the effects of geometry on cross talk, heat dissipation and attenuation of reverberations within the device.
Keywords
acoustic waveguides; cooling; reverberation; structural acoustics; ultrasonic propagation; ultrasonic velocity; buffer waveguide; flow measurement; heat dissipation; plate bundle waveguides; propagating wave mode velocity; reverberation attenuation; thermal gradient effects; ultrasonic flow meter buffer; Face; Heating; Reflection; Reverberation; Temperature dependence; Temperature measurement; flow; piezoelectric transducer; thermal buffer; waveguide;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2013 IEEE International
Conference_Location
Prague
ISSN
1948-5719
Print_ISBN
978-1-4673-5684-8
Type
conf
DOI
10.1109/ULTSYM.2013.0412
Filename
6724854
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