• DocumentCode
    3092619
  • Title

    An optimized 0.1 um T-gate AlGaAs/InGaAs/GaAs PHEMT power amplifier MMIC for Ka-band applications

  • Author

    Sung-Jin Cho ; Cong Wang ; Maharjan, R.K. ; Nam-Young Kim

  • Author_Institution
    RFIC Center, Kwangwoon Univ., Seoul, South Korea
  • fYear
    2012
  • fDate
    4-7 Dec. 2012
  • Firstpage
    4
  • Lastpage
    6
  • Abstract
    In this paper, a AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistor (PHEMT) monolithic microwave integrated circuit (MMIC) power amplifier for Ka band applications is presented. PHEMT AlGaAs/InGaAs/GaAs epi-layers are grown by metal organic chemical vapor deposition (MOCVD) and 100 nm gate lengths is realized by double exposure e-beam lithography method. The device fabricated by the double exposure processes is presented maximum saturation current densities (IDS max) of 680 mA/mm and the peak extrinsic transconductance (gm max) of 485 mS/mm, respectively. In case of RF performance, current gain cutoff frequency (fT) of 56 GHz, maximum stable gain (fmax) of 84 GHz and yielding a power density of 10 W/mm at 30GHz are indicated. The three-stage MMIC power amplifier is designed to fully match the 50 Ω input and output impedances. With 6 V and -0.75 V DC bias, a 1 dB compression power (P1dB) of 29.5 dBm, a power added efficiency (PAE) of 31% are achieved from 28.5 to 31.5 GHz. The proposed Ka-band power amplifier is designed within a die size of about 3.3 × 1.9 mm2 on GaAs substrate.
  • Keywords
    HEMT integrated circuits; III-V semiconductors; MMIC power amplifiers; MOCVD; aluminium compounds; current density; electron beam lithography; gallium arsenide; indium compounds; AlGaAs-InGaAs-GaAs; Ka-band applications; MOCVD; RF performance; T-gate PHEMT power amplifier MMIC; current gain cutoff frequency; double exposure e-beam lithography method; double exposure process; frequency 28.5 GHz to 31.5 GHz; frequency 56 GHz; frequency 84 GHz; maximum saturation current densities; metal organic chemical vapor deposition; monolithic microwave integrated circuit; peak extrinsic transconductance; power added efficiency; pseudomorphic high electron mobility transistor; resistance 50 ohm; size 0.1 mum; voltage -0.75 V; voltage 6 V; Gain; Gallium arsenide; Lithography; Logic gates; MMICs; PHEMTs; Power amplifiers; GaAs PHEMT; MMIC; e-beam lithography; power amplifiers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference Proceedings (APMC), 2012 Asia-Pacific
  • Conference_Location
    Kaohsiung
  • Print_ISBN
    978-1-4577-1330-9
  • Electronic_ISBN
    978-1-4577-1331-6
  • Type

    conf

  • DOI
    10.1109/APMC.2012.6421479
  • Filename
    6421479