• DocumentCode
    3092810
  • Title

    Acoustic loss mechanism in silicon dioxide films for temperature compensated surface acoustic wave devices

  • Author

    Matsuda, Shodai ; Miura, Masaki ; Matsuda, Tadamitsu ; Ueda, Makoto ; Satoh, Y. ; Hashimoto, Ken-ya

  • Author_Institution
    Taiyo Yuden Co., Ltd., Akashi, Japan
  • fYear
    2013
  • fDate
    21-25 July 2013
  • Firstpage
    1057
  • Lastpage
    1060
  • Abstract
    This paper investigates origin of the excess acoustic propagation loss caused in silicon dioxide (SiO2) with deposition temperature T. It is shown that SiO2 prepared lower T gives higher surface acoustic wave (SAW) attenuation and larger optical attenuation in the UV region. The Raman spectroscopy shows the increase of the peak in the small wave number region. These results show that the acoustic propagation loss is caused by the distortion of Si-O network structure and the optical characterization is quite useful for the analysis of the attenuation mechanism as well as the TCE behavior in SiO2-based films.
  • Keywords
    Raman spectroscopy; optical attenuators; silicon compounds; surface acoustic wave devices; Raman spectroscopy; SAW attenuation; Si-O; SiO2; TCE behavior; UV region; acoustic propagation loss; deposition temperature; network structure; optical attenuation; optical characterization; temperature compensated surface acoustic wave devices; Attenuation; Optical films; Optical resonators; Surface acoustic wave devices; Surface acoustic waves; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2013 IEEE International
  • Conference_Location
    Prague
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-5684-8
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2013.0271
  • Filename
    6724865