DocumentCode
3092810
Title
Acoustic loss mechanism in silicon dioxide films for temperature compensated surface acoustic wave devices
Author
Matsuda, Shodai ; Miura, Masaki ; Matsuda, Tadamitsu ; Ueda, Makoto ; Satoh, Y. ; Hashimoto, Ken-ya
Author_Institution
Taiyo Yuden Co., Ltd., Akashi, Japan
fYear
2013
fDate
21-25 July 2013
Firstpage
1057
Lastpage
1060
Abstract
This paper investigates origin of the excess acoustic propagation loss caused in silicon dioxide (SiO2) with deposition temperature T. It is shown that SiO2 prepared lower T gives higher surface acoustic wave (SAW) attenuation and larger optical attenuation in the UV region. The Raman spectroscopy shows the increase of the peak in the small wave number region. These results show that the acoustic propagation loss is caused by the distortion of Si-O network structure and the optical characterization is quite useful for the analysis of the attenuation mechanism as well as the TCE behavior in SiO2-based films.
Keywords
Raman spectroscopy; optical attenuators; silicon compounds; surface acoustic wave devices; Raman spectroscopy; SAW attenuation; Si-O; SiO2; TCE behavior; UV region; acoustic propagation loss; deposition temperature; network structure; optical attenuation; optical characterization; temperature compensated surface acoustic wave devices; Attenuation; Optical films; Optical resonators; Surface acoustic wave devices; Surface acoustic waves; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2013 IEEE International
Conference_Location
Prague
ISSN
1948-5719
Print_ISBN
978-1-4673-5684-8
Type
conf
DOI
10.1109/ULTSYM.2013.0271
Filename
6724865
Link To Document