Title :
A 32×32 integrated CMUT array for volumetric ultrasound imaging
Author :
Bhuyan, A. ; Chienliu Chang ; Jung Woo Choe ; Byung Chul Lee ; Nikoozadeh, Amin ; Oralkan, O. ; Khuri-Yakub, Butrus T.
Author_Institution :
Stanford Univ., Stanford, CA, USA
Abstract :
Real-time 3D volumetric ultrasound imaging systems require transmit and receive circuitry to generate the ultrasound beam and process the received echo signals. Since a 2D array is required for 3D imaging, the complexity of building such a system is significantly higher, e.g., front-end electronics need to be interfaced to the transducer, a large number of elements need to be interfaced to the backend system and a large dataset needs to be processed. In this work, we present a 3D imaging system using capacitive micromachined ultrasonic transducer (CMUT) technology that addresses many of the challenges in building such a system. The transducer is a 5-MHz CMUT array with an 8 mm × 8 mm aperture size. The aperture consists of 1024 elements (32×32) with an element pitch of 250 μm. An integrated circuit (IC) is integrated very close to the CMUT array. It consists of a transmit beamformer and receive circuitry to improve the noise performance of the overall system. Simultaneous multi-beam transmit is also incorporated in the IC to improve the imaging frame rate. The CMUT is flip-chip bonded to the IC and the final assembly measured 9.2 mm × 9.2 mm. The assembly was then interfaced with an FPGA and a backend system (comprising of a data acquisition system and PC). The FPGA provided the digital I/O signals for the IC and the backend system was used to process the received RF echo data (from the IC) and reconstruct the volume image using a phased array imaging approach. Imaging experiments were performed using wire phantoms. Real-time volumetric images were captured at 5 volumes per second and are presented in this paper.
Keywords :
biomedical electronics; biomedical transducers; biomedical ultrasonics; capacitive sensors; data acquisition; field programmable gate arrays; flip-chip devices; image denoising; image reconstruction; medical image processing; micromachining; phantoms; self-assembly; ultrasonic imaging; ultrasonic transducer arrays; 32×32 integrated CMUT array; FPGA; backend system; beamformer; capacitive micromachined ultrasonic transducer technology; data acquisition system; dataset; digital I-O signals; element pitch; final assembly; flip-chip bonding; frequency 5 MHz; front-end electronics; integrated circuit; noise performance; phased array imaging approach; real-time 3D volumetric ultrasound imaging systems; receive circuitry; received RF echo data; received echo signal processing; simultaneous multibeam transmission; ultrasound beam generation; volume image reconstruction; wire phantoms; Arrays; Assembly; Flip-chip devices; Imaging; Integrated circuits; Three-dimensional displays; Ultrasonic imaging; 2D array; 3D volumetric imaging; capacitive micromachined ultrasonic transducer (CMUT); flip-chip bonding; integrated circuits; phased array imaging; real-time; ultrasound;
Conference_Titel :
Ultrasonics Symposium (IUS), 2013 IEEE International
Conference_Location :
Prague
Print_ISBN :
978-1-4673-5684-8
DOI :
10.1109/ULTSYM.2013.0141