The design of a vector hydrophone´s chip-level damping structure

A novel damping spring structure is designed based on the existing structure of MEMS vector hydrophone. It is desirable that this novel structure can improve the antinoise ability of hydrophone. According to finite element simulation by Ansys, the geometry, stiffness and location of the spring are determined. Two pairs of spring are adopted and placed inside and outside vertically. Simulation results show that the reducing flow noise ability of this damping structure can be increased by 3 times, as well as it does not affect the sensitivity of hydrophone. The advantages of this chip-level spring damping structure are one integrated, good consistency and engineering applications.