DocumentCode
3094168
Title
S-sequence bias-encoded photoacoustic imaging with top Orthogonal to Bottom Electrode (TOBE) CMUT arrays
Author
Zemp, Roger J. ; Chee, Ryan ; Sampaleanu, Alexander ; Rishi, Deepak ; Forbrich, Alexander
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Alberta, Edmonton, AB, Canada
fYear
2013
fDate
21-25 July 2013
Firstpage
1197
Lastpage
1200
Abstract
Recently we introduced Top Orthogonal to Bottom Electrode (TOBE) Capacitive Micromachined Ultrasound Transducers (CMUTs) as novel 2D arrays capable of 3D ultrasound imaging using only N transmit/receive and N bias channels for an NxN array. Here we adapt these devices for photoacoustic imaging by biasing one column and receiving across rows in parallel, then biasing another column and receiving along rows, and repeating this procedure until all columns have been biased in turn. Only elements in rows which are biased are dominantly sensitive to receive signals. Additionally, we propose a method to bias more than one column at a time using a biasing pattern sampled from rows or columns of a Hadamard S-matrix to improve signal-to-noise ratio, and demonstrate simulation results validating the proposed theory.
Keywords
S-matrix theory; acoustic noise; acoustic signal processing; electrodes; photoacoustic effect; ultrasonic imaging; ultrasonic transducer arrays; 3D ultrasound imaging; CMUT arrays; Hadamard S-matrix; S-sequence bias-encoded photoacoustic imaging; capacitive micromachined ultrasound transducer arrays; novel 2D arrays; signal-to-noise ratio; top orthogonal-to-bottom electrode; Apertures; Electrodes; Encoding; Imaging; Signal to noise ratio; Transducers; Ultrasonic imaging; 2D arrays; 3D ultrasound imaging; CMUTs; MEMS;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2013 IEEE International
Conference_Location
Prague
ISSN
1948-5719
Print_ISBN
978-1-4673-5684-8
Type
conf
DOI
10.1109/ULTSYM.2013.0306
Filename
6724922
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